| 著作標題 |
Post-treatment of Nb2O5 Compact Layer in Dye-sensitized Solar Cells for Low-level Lighting Applications
|
| 發表期刊 |
Journal of Materials Science: Materials in Electronics |
| 著作人 |
Kai-Wen Chen, Li-Syuan Chen, and Chih-Ming Chen |
| 發表時間 |
2019 |
| 頁數 |
11 |
|
| 著作標題 |
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
|
| 發表期刊 |
Microelectronics Reliability |
| 著作人 |
Zeyang Zheng, Ping-Chen Chiang, Yu-Ting Huang, Wei-Ting Wang, Po-Chien Li, Ya-Hui Tsai, Chih-Ming Chen , and Shien-Ping Feng |
| 發表時間 |
2019 |
| 頁數 |
8 |
|
| 著作標題 |
Efficient and Adhesiveless Metallization of Flexible Polyimide by Functional Grafting of Carboxylic Acid Groups
|
| 發表期刊 |
Langmuir |
| 著作人 |
Tzu-Jung Liu, Chien-Han Chen, Pei-Yu Wu, Ching-Hsuan Lin, and Chih-Ming Chen |
| 發表時間 |
2019 |
| 頁數 |
10 |
|
| 著作標題 |
Impurity evaporation and void formation in Sn/Cu solder joints
|
| 發表期刊 |
Materials Chemistry and Physics |
| 著作人 |
Hsuan-Ling Hsu, Hsuan Lee, Chi-Wei Wang, Chenju Liang, and Chih-Ming Chen |
| 發表時間 |
2019 |
| 頁數 |
26 |
|
| 著作標題 |
Influence of Additives on Electroplated Copper Films and Their Solder Joints
|
| 發表期刊 |
Materials Characterization |
| 著作人 |
Hsuan Lee, Shan-Ting Tsai, Ping-Heng Wu, Wei-Ping Dow, and Chih-Ming Chen |
| 發表時間 |
2019 |
| 頁數 |
7 |
|
| 著作標題 |
Study of Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys
|
| 發表期刊 |
Journal of Electronic Materials |
| 著作人 |
Yee-Wen Yen, William Yu, Chu-Hsuan Wang, Chih-Ming Chen , Yu-Chun Li, Pei-Yu Chen, and Guan-Da Chen |
| 發表時間 |
2019 |
| 頁數 |
12 |
|
| 著作標題 |
Electrodeposition of Ni on Bi2Te3 and Interfacial reaction between Sn and Ni-coated Bi2Te3
|
| 發表期刊 |
Journal of Electronic Materials |
| 著作人 |
Yu-Chen Tseng, Hsuan Lee, Nga Yu Hau, Shien-Ping Feng, and Chih-Ming Chen |
| 發表時間 |
2018 |
| 頁數 |
8 |
|
