| 著作標題 |
Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding
|
| 發表期刊 |
Materials Chemistry and Physics |
| 著作人 |
Shao-Yu Hsu, Chih-Ming Chen , Jenn-Ming Song, and Hiroshi Nishikawa |
| 發表時間 |
2022 |
|
| 著作標題 |
Surface co-silanization engineering to enhance amine functionality for adhesive heterojunction and antimicrobial application
|
| 發表期刊 |
Composites Science and Technology |
| 著作人 |
Ya-Ching Chang, Manik Chandra Sil, Yan-Ping Zhang, Shu-Chiao Chou, Ying-Xing Liu, Si-Yu Li*, and Chih-Ming Chen |
| 發表時間 |
2022 |
|
| 著作標題 |
Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization
|
| 發表期刊 |
Materials Characterization |
| 著作人 |
Li-Chi Huang, Yan-Ping Zhang, Chih-Ming Chen , Liang-Yih Hung, Yu-Po Wang |
| 發表時間 |
2022 |
|
| 著作標題 |
Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding
|
| 發表期刊 |
Journal of the Taiwan Institute of Chemical Engineers |
| 著作人 |
Jhih-Jhu Jhan, Kazutoshi Wataya, Hiroshi Nishikawa, and Chih-Ming Chen |
| 發表時間 |
2022 |
|
| 著作標題 |
Interfacial reactions in Ni/Se-90 at.%Te and Ni/Pb1-xSnxSe couples
|
| 發表期刊 |
Materials Chemistry and Physics |
| 著作人 |
Y. Hutabalian, C.-M. Chen , H.-H. Chen, Z.-K. Hu, and S.-W. Chen |
| 發表時間 |
2022 |
|
| 著作標題 |
Polyimide-based covalent organic framework as a photocurrent enhancer for efficient dye-sensitized solar cells
|
| 發表期刊 |
ACS Applied Materials & Interfaces |
| 著作人 |
Pei-Hsuan Chang, Manik Chandra Sil, Kamani Sudhir K. Reddy, Ching-Hsuan Lin, and Chih-Ming Chen |
| 發表時間 |
2022 |
|
| 著作標題 |
Influences of impurity incorporation in electroplated Cu on the SnAgCu and Ni-containing SnAgCu solder joints
|
| 發表期刊 |
Journal of the Electrochemical Society |
| 著作人 |
Po-Kai Chen, Yu-Ju Li, Yee-Wen Yen, and Chih-Ming Chen |
| 發表時間 |
2022 |
|
| 著作標題 |
Interfacial reactions between pure indium solder and Au/Ni metallization
|
| 發表期刊 |
Journal of Materials Science: Materials in Electronics |
| 著作人 |
Li-Chi Huang, Yan-Ping Zhang, Chih-Ming Chen , Liang-Yih Hung, Yu-Po Wang |
| 發表時間 |
2022 |
|
| 著作標題 |
Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface During Isothermal Aging
|
| 發表期刊 |
Materials |
| 著作人 |
Jia-Yi Lee, Chih-Ming Chen |
| 發表時間 |
2022 |
|
| 著作標題 |
Study of synergy of monoethanolamine and urea on copper corrosion inhibition in alkaline solution
|
| 發表期刊 |
Journal of Molecular Liquids |
| 著作人 |
Hong-Da Chang, Bei-En Wu, Manik Chandra Sil, Zong-Hao Yang, and Chih-Ming Chen |
| 發表時間 |
2022 |
|
